Aluminum powder sintering uniform temperature plate
Most of the existing uniform temperature plates are copper substrates to facilitate welding, and the manufacturing method includes a sintered structure. In the sintered structure, it is usually the surface of the copper shell, and the surface is formed of sintered powder to form micropores to achieve condensation and reflux. However, the sintering temperature of powder sintering is high, time-consuming and laborious, and it is difficult to form powder sintering. The consistency of the sintering densification effect cannot be guaranteed, which results in the performance difference and poor stability of the soaking plate. Therefore, how to provide a soaking plate and a method for manufacturing the soaking plate to avoid high-temperature sintering, reduce energy consumption and cost, and Making the performance of the soaking plate more stable has become an urgent problem in this field.
A method for manufacturing an aluminum powder sintered temperature equalizing plate, including the following steps: 1) separately fabricating an upper aluminum powder shell assembly and a lower aluminum shell assembly with foamed aluminum; 2) combining the upper aluminum shell assembly with the lower aluminum shell assembly The aluminum shell components are buckled together to form an aluminum uniform temperature plate body with a cavity therein; 3) the aluminum powder uniform temperature plate body is sealed, evacuated and injected with working fluid; step 1) includes the following steps: 1a) Fabricate the lower aluminum shell with heat dissipation fins and the upper aluminum shell with heat absorption surface respectively; 1b) process the upper and lower aluminum foam powders that match the upper and lower aluminum shells; 1c) combine the upper aluminum foam powder Sintered with the upper aluminum shell to form the upper aluminum shell assembly; and sintered the lower foamed aluminum powder and the lower aluminum shell together to form the lower aluminum shell assembly. The manufacturing method is simple, the cost is low, and the formed aluminum powder sintering uniform temperature plate has excellent thermal performance, high structural strength, and can effectively reduce the weight of the radiator.
The temperature equalizing plate technology is similar to the heat pipe in principle, but the conduction method is different. The heat pipe is one-dimensional linear heat conduction, and the heat in the vacuum chamber soaking plate is conducted on the two-dimensional surface, so the efficiency is higher. Specifically, the liquid at the bottom of the vacuum chamber absorbs the heat of the chip, evaporates and diffuses into the vacuum chamber, conducts the heat to the heat sink, then condenses into liquid, and then returns to the bottom. The evaporation and condensation process similar to the refrigerator air conditioner circulates rapidly in the vacuum chamber, thereby achieving higher heat dissipation efficiency.
A method for manufacturing an aluminum powder sintered temperature equalizing plate includes the following steps: 1) separately fabricating an upper aluminum housing assembly and a lower aluminum housing assembly with foamed aluminum powder; 2) combining the upper aluminum housing assembly with the lower aluminum housing assembly The aluminum shell components are buckled together to form an aluminum powder uniform temperature plate body with a cavity therein; 3) the aluminum powder uniform temperature plate body is sealed, vacuumed, and working fluid is injected.
The uniform temperature plate has been widely used in the field of heat dissipation of electronic equipment. The isothermal plate uses the phase change process of the working medium to achieve the purpose of effective heat transfer by absorbing and releasing latent heat. And it can effectively dissipate heat with high heat flux density "hot spots" and flatten it into a relatively uniform temperature field. How to make smaller, thinner, and larger heat transfer temperature equalization plates is of great significance to the field of electronic equipment heat dissipation.
Load heat dissipation technology is facing the demand for high heat flux density and high temperature uniformity heat dissipation. The uniform temperature plate is an effective heat transfer element to achieve this demand. The uniform temperature plate has a high thermal conductivity, good temperature uniformity performance and thermal diffusion The performance and compact structure have broad application prospects in the field of load heat dissipation. The performance of the uniform temperature plate depends on the design level and the level of processing technology. Therefore, the development of the uniform temperature plate heat dissipation technology is inseparable from the understanding and exploration of its working mechanism. The mastery and improvement of its processing technology, as well as the discovery and optimization of its design method. This paper analyzes the heat transfer mechanism and heat transfer limit of the uniform temperature plate, and uses the thermal resistance network method to estimate the thermal resistance of each heat transfer link of the uniform temperature plate On this basis, a sintered aluminum powder uniform temperature plate was designed, and the pressure check, heat transfer limit check and thermal resistance trial calculation were carried out on it. A set of aluminum powder-based uniform temperature plate was proposed. The processing process, the filling platform of the uniform temperature plate was built, and the prototype of the uniform temperature plate was produced. The performance test system of the uniform temperature plate was designed and built, and a systematic experimental study was carried out on the uniform temperature plate. The experimental results show that the uniform temperature plate The temperature plate can quickly reach stability when the heating power changes, and has excellent starting performance; the maximum temperature difference between the condensing surface and the evaporation surface of the uniform temperature plate can be maintained at a low level, and it is relatively equal to the aluminum powder alloy plate of the same size. The advantages of temperature performance become more obvious with the increase of heating power and heat flow; the uniform temperature plate has a lower thermal resistance, but the thickness affects its heat transfer performance. The experiment found that the working angle has an effect on the heat transfer and uniform temperature performance of the uniform temperature plate prototype. influential.